Modern Magnetic Systems
Conference Paper
2003
Investigation of Electromigration in Copper Interconnects by Noise Measurements
| Author(s): | Emelianov, V. and Ganesan, G. and Puzic, A. and Schulz, S. and Eizenberg, M. and Habermeier, H.-U. and Stoll, H. |
| Book Title: | Noise as a Tool for Studying Materials |
| Pages: | 271--281 |
| Year: | 2003 |
| Series: | {Proceedings of SPIE} |
| BibTeX Type: | Conference Paper (inproceedings) |
| Address: | Santa Fe, New Mexico |
| Electronic Archiving: | grant_archive |
| Language: | eng |
BibTeX
@inproceedings{escidoc:0800,
title = {{Investigation of Electromigration in Copper Interconnects by Noise Measurements}},
booktitle = {{Noise as a Tool for Studying Materials}},
pages = {271--281},
series = {{Proceedings of SPIE}},
address = {Santa Fe, New Mexico},
year = {2003},
author = {Emelianov, V. and Ganesan, G. and Puzic, A. and Schulz, S. and Eizenberg, M. and Habermeier, H.-U. and Stoll, H.}
}